Vortex Nozzle
Vortex Nozzle spray plume against centimetre scales: distance below the nozzle (left) and width across the plume (bottom)

ULTRASONIC NOZZLE

Vortex Nozzle

The Vortex Ultrasonic Nozzle integrates ultrasonic atomization with a spiral gas stream to generate a stable, controllable cyclone spray. Whether applied to uniform thin-film deposition or ceramic spray drying, this configuration disperses ultra-fine droplets over wide areas for superior coating uniformity and process efficiency. By inducing rotational airflow at the nozzle outlet, the vortex head directs atomized particles into a stable, wide-angle cone. The combination of droplet size control (via frequency: 60 kHz or 120 kHz) and gas-driven ultrasonic spray shaping significantly enhances uniformity on planar, curved, or recessed surfaces. Compatible with nanoparticle suspensions, sol-gels, enzymes, conductive inks, and bio-reagents.

How This Ultrasonic Spray Nozzle Works

The vortex nozzle uses a spiral gas stream to create a stable, wide-angle cone of atomized droplets. A rotational airflow at the nozzle outlet disperses ultra-fine droplets over wide areas, optimizing coating uniformity and efficiency. Gas pressure adjusts spray angle and throw distance without disturbing droplet size, while the vortex-driven turbulence minimizes droplet coalescence and promotes lateral distribution. Wide spray coverage at fixed stand-off heights makes the vortex head ideal for wafers, tubes, and roll-to-roll systems. The nozzle integrates directly with robotic and gantry-type positioning systems for automated production environments.

Vortex Nozzle diagram
Cutaway of the Vortex Nozzle assembly with the liquid feed tube running through the center to the tip

Product Demos

Vortex Nozzle Spray Demo

Vortex Nozzle Spray Demo

Vortex Nozzle producing a wide-pattern conical spray using isopropyl alcohol for visibility. Footage slowed to 40%.

Zirconia Ceramic Vortex — 60 kHz

Zirconia Ceramic Vortex — 60 kHz

60 kHz zirconia ceramic Vortex Nozzle in operation, showcasing durability for high-wear coating applications.

6-Inch Wafer Coating

6-Inch Wafer Coating

Vortex Nozzle depositing across a 6-inch wafer, demonstrating uniform coverage for semiconductor thin-film applications.

Spray Diameter

~15 cm (6 in) at 25 cm (10 in) stand-off

Droplet Size

15–40 µm (60 kHz), 10–25 µm (120 kHz)

Frequency

60 kHz or 120 kHz

Spray Pattern

Conical, vortex-stabilized

Air Sheath Pressure

0.1–2.0 bar (adjustable)

Fluid Viscosity

< 50 cP, water-based or alcohol-based

Vortex Spray Nozzle Features

Wide Spray Coverage at Fixed Heights

15 cm (6 in) spray diameter at 25 cm (10 in) stand-off distance for efficient large-area coating.

Micron-Size Droplet Control

10 µm (120 kHz) for ultra-thin, defect-free films.

Enhanced Mixing and Homogeneity

Vortex-driven turbulence minimizes coalescence and promotes uniform lateral distribution.

Air-Pressure Tunable

Gas pressure adjusts spray angle and throw without disturbing droplet size.

Broad Fluid Compatibility

Works with nanoparticle suspensions, sol-gels, enzymes, conductive inks, and bio-reagents.

Key Advantages

  • Semiconductor wafer coatings: photoresist, ALD precursors, dielectrics on 100–300 mm wafers
  • Biomedical device functionalization with inks or quantum dots on catheters, stents, and syringes
  • Solar cell thin films: perovskites, quantum dots, and CIGS structures
  • Catalyst deposition on porous substrates: foam and mesh in fuel cells or reactors

Ideal Applications

Supporting Research

Peer-reviewed publications and technical literature relevant to this application area. Links open the publisher's site.

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