ELECTRONICS APPLICATION

EMI Shielding Coating

Ultrasonic spray deposition of conductive EMI shielding coatings on semiconductor packages, module lids, and enclosures — a lower-cost, faster alternative to sputtering for package-level shielding.

Discuss Your Application

The Challenge

Densely packed RF electronics — 5G modules, system-in-package designs, automotive radar — need electromagnetic shielding at the individual package level. Sputtered metal shields deliver good performance but require vacuum equipment, slow cycle times, and high capital cost. Conventional spraying of silver-loaded shielding inks struggles with uniformity on package sidewalls and wastes expensive conductive material as overspray.

Our Solution

MicroSpray ultrasonic nozzles atomize silver and other conductive shielding formulations into a fine, low-velocity mist that wraps uniformly over package tops and sidewalls. The vibrating tip keeps metal particles in suspension without settling or clogging, so highly loaded inks spray consistently across a full production shift. Transfer efficiency above 90% cuts silver consumption, and the process runs at atmospheric pressure — no vacuum chamber, no batch loading.

Why Ultrasonic Spray?

✓Uniform conductive films on package tops and sidewalls for effective shielding
✓Atmospheric process — far lower capital and operating cost than sputtering
✓Over 90% transfer efficiency reduces spend on silver-loaded inks
✓Vibrating nozzle tip prevents settling and clogging of metal-particle formulations
✓Coating thickness tuned by feed rate and pass count to hit target shielding effectiveness
✓Compatible with silver, copper, and hybrid conductive shielding materials
✓Selective spraying reduces masking compared to broad-pattern spray guns
✓Scales from prototype packages to inline production